News

Media Alert: Join Intel Innovation on Sept. 19-20

Intel Ignite Launches First London Cohort

Intel Leads the Way with Advanced Packaging

Once given little attention in chipmaking, packages are changing how chips are designed and created – and, ultimately, what chips can do.

Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement

Intel’s advanced 300 mm manufacturing facility in New Mexico to provide new capacity corridor for Tower, helping fuel future growth.

Intel Unveils Future-Generation Xeon with Robust Performance and Efficiency Architectures

Architecting the Future of Supercomputing

Intel Announces Termination of Tower Semiconductor Acquisition

Intel continues to advance plans to create world-class system foundry as part of its IDM 2.0 strategy.

Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes

The agreement will allow designers to realize the advantages of Intel 3 and Intel 18A process technologies and to bring differentiated products to market.

Intel Corporation to Participate in Upcoming Investor Conferences

Intel, Samsung Deliver Innovative vRAN Solutions

Intel, Lenovo Open Co-Engineering Lab in Shanghai

4th Gen Intel Xeon Momentum Grows in the Cloud